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Download Nano-CMOS Circuit and Physical Design by Ban Wong, Anurag Mittal, Yu Cao, Greg W. Starr PDF

By Ban Wong, Anurag Mittal, Yu Cao, Greg W. Starr

In keeping with the authors' expansive choice of notes taken through the years, Nano-CMOS Circuit and actual layout bridges the distance among actual and circuit layout and fabrication processing, manufacturability, and yield. This leading edge ebook covers: technique expertise, together with sub-wavelength optical lithography; influence of technique scaling on circuit and actual implementation and coffee energy with leaky transistors; and DFM, yield, and the impression of actual implementation.

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Cobalt is typically capped with titanium or TiN during the blanket metal deposition to protect it from oxidation. The cap is then removed during the selective etch between RTP1 and RTP2. Scaling limitations of cobalt silicide are seen below 50-nm line widths and are driving the industry to shift to nickel silicide. NiSi maintains low sheet resistance below 30-nm line widths [56]. 10. However, this results in excessive silicidation of narrow lines, indicated by a decrease in sheet resistance versus gate length below 100 nm.

Agarwal, M. Hrishikesh, S. Keckler, and D. Burger, Clock rate vs. IPC: the end of the road for conventional microarchitectures, 27th Annual International Symposium on Computer Architecture, June 2000. [14] T. Sakurai, Issues of current LSI technology and an expectation for new systemlevel integration, International Conference on Solid State Devices and Materials, pp. 36–37, Sept. 2001. [15] K. Osada, Y. Saitoh, E. Ibe, and K. 2, International Solid-State Conference, 2003. [16] R. Rios, W. K. Shih, A.

19] A. Stamper, Interconnection scaling to 1 GHz and beyond, MicroNews, Vol. 4, No. 2, first quarter 1998. net. [21] P. Ranade, H. Takeuchi, W. Lee, V. Subramanian, and T. King, Application of silicon–germanium in the fabrication of ultra-shallow extension junctions for sub100 nm PMOSFTs, IEEE Trans. Electron Devices, Vol. 49, No. 8, Aug. 2002. REFERENCES 23 [22] S. , A 90 nm logic technology featuring 50 nm strained silicon channel transistors, 7 layers of Cu interconnects, low κ ILD, and 1 µm2 SRAM cell, IEEE International Electron Devices Meeting, 2002.

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